Z-PlaneÔ Inc was founded by Chuck Byer and Tim Lemke to provide new packaging technology for high-speed telecommunications and computing equipment.  The product concept came into existence as a direct result of their long-term product development experience, and specifically, the deep understanding of the technical issues related to high-speed interconnection signal processing gained by Tim during his 30 year participation as a design engineer in the connector industry and the electronics marketplace.  Consequently, the management team is proven and ready, and has the managerial, technical, marketing, and manufacturing expertise required to develop, launch and grow a successful technical product company.  Current key management personnel include: 

Charles C. Byer (President, CEO) – Mr. Byer is an experienced and proven business executive with 30 years of new product, new business and new market development experience, largely in the electronics and instrumentation industries.  He is a specialist in design and engineering firm management and new business development.  His background includes service as:  President and CEO of PCT LLC, a business development consulting company;  COO of Pacific Consultants, a design and engineering firm with a long history of successful development of ruggedized, field-operable systems and devices for military armed combat (in particular, the Land Warrior system), medical diagnostics, and industrial applications; President and CEO of Power Spectra, Inc., a publicly held designer and manufacturer of ground penetrating radar devices, laser rangefinders, and military electronics; President and CEO of Beta Phase, Inc., a publicly held high-speed connector company (acquired by Molex, Inc.); and, multiple management capacities at the DuPont Company, which included responsibilities in marketing, manufacturing, and engineering, largely in the Berg Electronics and Scientific & Process Instruments Divisions.  Mr. Byer holds a BSEE from the Pennsylvania State University and an MBA from the Wharton School at the University of Pennsylvania.

Timothy A. Lemke (CTO) – Mr. Lemke has more than 30 years of experience in electronic interconnection and packaging technology in a variety of capacities, primarily as a design engineer.  He has worked in that capacity for major connector companies such as, AMP, Burndy, and DuPont (Berg Electronics, now FCI).  He also started his own company, Broadside Technology LLC, and has been consulting with several connector companies.  He has authored a number of technical publications and has been involved in a number of innovative, award winning product designs, including:  Copalum™, PicoWire™, MicroPax™, AirMax ™ and Meg-Array™.  As an inventor, to date Mr. Lemke has been awarded 55 issued U.S. patents relating to connector and interconnection system design, cabling, and termination processes.  Mr. Lemke has numerous publications and professional awards and holds a BS from Ursinus College in Pennsylvania.